Materialographic Preparation

Materialographic Preparation involves a sequence of techniques used to prepare the true structure of a specimen for analysis. Sectioning or cutting is where most specimen preparation for analysis begins, followed by mounting if it is required to help assist with mechanical preparation and/or analysis. Mechanical grinding and polishing are the key processes to produce reflective and deformation free surfaces.

For homogenous metals electrolytic preparation can be a substitute or supplement to mechanical processes. Etching is used to create contrast and reveal structural features within the surface.

It’s important to understand the principles of operation of each technique and how the different process parameters affect the specimen surface and material to help choose suitable consumables and methods to minimise deformation to the specimen surface and creation of artefacts during preparation.

Sequence of Processing Steps

processing steps sequence

Cutting

Equipment Name

Struers Accutom-50
Note: Technical operated instrument only

Specifications

Cutting Speed

300 – 5000rpm

Feed Speed

0.005 – 3.000 mm/s, adjustable in steps of 0.005 mm/s

Max Positioning Speed

Y = 13 mm/s, X = 13 mm/s

Force Limits Low = ~20N, Med = ~40N, High = ~60N
Positioning Range

Y direction = 105 mm (precision 0.1 mm),

X direction = 60 mm (precision 0.005 mm)

Maximum length Cut-off sample 30 mm, 140 mm at Ø 20 mm
Maximum length of sample to be clamped 225 mm
Maximum Sample Cross Section

Ø127 mm cut-off wheel and Ø42 mm flange = Ø40 mm (without rotation),

Ø 80 mm (with rotation)

SOP

Cutting on Accutom 50 SOP (PDF, 104.3 KB)

Instruction manual

Accutom-50 Instructions Manual

Resources

Cutting of Materials (PDF, 174.5 KB)

Knowledge on Cutting

Cut-off Wheel Selection Guide

Troubleshooting

Booking address

*G SEBE ENG Lab Eqpmt KE2.101 Precision cut-off machine

Heat Treatment

Information to come.

For assistance, contact the Materials team

Mounting

Equipment Name

Struers CitoPress-10

Specifications

Mounting Unit

Ø30 mm

Mounting Pressure

50 – 350 bar in steps of 25 bar

Mounting Heating Time

1 – 15 min in steps of 0.5 min

Mounting Heating Temperature 80 – 180 °C in steps of 5°C
Mounting Cooling Time

1 – 15 min in steps of 0.5 min

Mounting Cooling Rate High = full flow (4.8L/min), Med = 20% of full flow, Low = 5% of full flow
Sensitive Option Dual phase heating and pressure for fragile/porous specimens

SOP

Hot mounting on CitoPress-10 SOP (PDF, 79.6 KB)

Instruction manual

CitoPress-10 -20 Instructions Manual

Resources

How to Select a Mounting Method (PDF, 58.4 KB)

About Mounting  (PDF, 571.6 KB)

Knowledge on Hot Mounting

Hot Mounting Resin Selection Guide

Troubleshooting Hot Mounting

Knowledge on Cold Mounting

Cold Mounting Resin Selection Guide

Cold Mounting Accessories

Troubleshooting Cold Mounting

Booking address

*G SEBE ENG Lab Eqpmt KE2.101.02 Hot-mounting press

Mechanical/Electrolytic Preparation

Equipment Name

Struers LaboPol-21 & LaboForce-3 System

Specifications

Cutting Speed

300 – 5000rpm

Feed Speed

0.005 – 3.000 mm/s, adjustable in steps of 0.005 mm/s

Max Positioning Speed

Y = 13 mm/s, X = 13 mm/s

Force Limits Low = ~20N, Med = ~40N, High = ~60N
Positioning Range

Y direction = 105 mm (precision 0.1 mm),

X direction = 60 mm (precision 0.005 mm)

Maximum length Cut-off sample 30 mm, 140 mm at Ø 20 mm
Maximum length of sample to be clamped 225 mm
Maximum Sample Cross Section

Ø127 mm cut-off wheel and Ø42 mm flange = Ø40 mm (without rotation),

Ø 80 mm (with rotation)

SOP

Grinding on LaboPol-21 SOP (PDF, 77.8 KB)

Instruction manual

LaboPol-21-25 Instruction Manual

LaboForce-3 Instruction Manual

Resources

See below

Booking address

*G SEBE ENG Lab Eqpmt KE2.101.02 Grinding machine

Equipment Name

Struers Tegramin

Specifications

Disc Diameter

250 mm

Disc Speed

40 – 600 rpm, variable

Rotational Direction

Counter-clockwise

Head Speed 50 – 150 rpm, variable
Rotational Direction

Clockwise or Counter clockwise

SOP

Polishing on Tegramin-25 SOP (PDF, 77.7 KB)

Instruction manual

Tegramin-25-30 Instruction Manual

Resources

See below

Booking address

*G SEBE ENG Lab Eqpmt KE2.101.02 Polishing machine

Resources

Etching

This step is optional. Information to come.

For assistance, contact the Materials team

Analysis

Information to come.

For assistance, contact the Materials team

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